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30 June 1998 High-speed 3D shape measurement using a nonscanning multiple-beam confocal imaging system
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Abstract
This paper describes a high-speed 3D shape measurement system for in-line semiconductor package inspections. The system consists of three parts. One is an optics and sensor for confocal imaging, which we call a non-scanning multiple- beam confocal microscope. The microscope can get a confocal image within very short time because XY-scanning, which is required in conventional confocal microscopes, is not needed. Another is the algorithm that performs reconstructing the object surfaces accurately from a few confocal images. The last is a mechanism that performs shifting the focused plane of the microscope very quickly. This experimental system can measure objects having a space of 9.6 X 9.6 X 0.64 mm in less than 0.4 s with an accuracy in the order of 1 micrometers .
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Mitsuhiro Ishihara and Hiromi Sasaki "High-speed 3D shape measurement using a nonscanning multiple-beam confocal imaging system", Proc. SPIE 3478, Laser Interferometry IX: Techniques and Analysis, (30 June 1998); https://doi.org/10.1117/12.312975
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