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22 May 1998 Architecture and optical system design for translucent smart pixel array (TRANSPAR) chips
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Proceedings Volume 3490, Optics in Computing '98; (1998)
Event: Optics in Computing '98, 1998, Bruges, Belgium
We present the architecture and optical design for a smart pixel optoelectronic system that performs very high throughput networking and three-dimensional single-instruction multiple-data (SIMD) parallel signal processing. The smart pixel chip in the system is called a TRANslucent Smart Pixel Array (TRANSPAR), and it contains a 2-D array of fine-grain processing elements with additional functionality for performing carrier-sense multiple access with collision detection (CSMAJCD) networking. This chip is currently being fabricated by Lucent through the DARPA/GMU/CO-OP foundry program in 0.5 micron CMOS with flip-chip bonded multiple quantum well (MQW) optical modulators and detectors (II.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
C.-H. Chen, Bogdan Hoanca, C. B. Kuznia, Alexander A. Sawchuk, and J.-M. Wu "Architecture and optical system design for translucent smart pixel array (TRANSPAR) chips", Proc. SPIE 3490, Optics in Computing '98, (22 May 1998);

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