Paper
22 May 1998 CMOS-compatible free-space optical interconnects
Christine T. Mollenkopf, John M. Hessenbruch, Jongwoo Kim, Richard V. Stone, Peter S. Guilfoyle
Author Affiliations +
Proceedings Volume 3490, Optics in Computing '98; (1998) https://doi.org/10.1117/12.308877
Event: Optics in Computing '98, 1998, Bruges, Belgium
Abstract
Photonic smart pixel arrays are being developed for use in high density input/output applications. Arrays containing 1024 smart pixels are integrated on a single chip which occupies 1.6 cm X 1.6 cm of area. A smart pixel cell is made up of a vertical cavity surface emitting laser (VCSEL), a detector, an analog receiver, a laser driver, and digital logic circuitry. Additional circuitry can be embedded in the smart pixel cell to provide increased functionality, such as digital logic operations and memory functions. A diffractive optical interconnect element can be added to the smart pixel array for optimization of a free space optical interconnect system. The oxide-confined GaAs/AlGaAs VCSELs and the GaAs/AlGaAs detectors will be flip-chip bonded to the surface of the CMOS substrate. The surface of the CMOS substrate will be processed after circuit fabrication in preparation for flip-chip bonding. This processing will make the pads of the CMOS compatible with the contacts of the VCSEL and detector surfaces. The integrated smart pixel combines low power consumption and high speed operation in an optoelectronic module for the use in high speed optical interconnects.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Christine T. Mollenkopf, John M. Hessenbruch, Jongwoo Kim, Richard V. Stone, and Peter S. Guilfoyle "CMOS-compatible free-space optical interconnects", Proc. SPIE 3490, Optics in Computing '98, (22 May 1998); https://doi.org/10.1117/12.308877
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KEYWORDS
Vertical cavity surface emitting lasers

Optical interconnects

Sensors

CMOS sensors

Digital electronics

Logic

Receivers

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