22 May 1998 Comparison of techniques for bonding VCSELs directly to ICs
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Proceedings Volume 3490, Optics in Computing '98; (1998) https://doi.org/10.1117/12.308861
Event: Optics in Computing '98, 1998, Bruges, Belgium
Abstract
The fabrication technologies and bonding characteristics of three VCSEL bonding techniques are compared in order to determine the more reliable and robust.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Rui Pu, Rui Pu, Eric M. Hayes, Eric M. Hayes, Carl W. Wilmsen, Carl W. Wilmsen, Kent D. Choquette, Kent D. Choquette, Hong Q. Hou, Hong Q. Hou, Kent M. Geib, Kent M. Geib, } "Comparison of techniques for bonding VCSELs directly to ICs", Proc. SPIE 3490, Optics in Computing '98, (22 May 1998); doi: 10.1117/12.308861; https://doi.org/10.1117/12.308861
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