Optomechanical, electrical, and thermal packaging of large 2D optoelectronic device arrays for free-space optical interconnects

Michael H. Ayliffe; D. Kabal; P. Khurana; Frederic K. Lacroix; Andrew G. Kirk; Frank A. P. Tooley; David V. Plant

doi:10.1117/12.308862

22 May 1998 Optomechanical, electrical, and thermal packaging of large 2D optoelectronic device arrays for free-space optical interconnects

Michael H. Ayliffe, D. Kabal, P. Khurana, Frederic K. Lacroix, Andrew G. Kirk, Frank A. P. Tooley, David V. Plant

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Proceedings Volume 3490, Optics in Computing '98; (1998) https://doi.org/10.1117/12.308862
Event: Optics in Computing '98, 1998, Bruges, Belgium

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Michael H. Ayliffe, D. Kabal, P. Khurana, Frederic K. Lacroix, Andrew G. Kirk, Frank A. P. Tooley, and David V. Plant "Optomechanical, electrical, and thermal packaging of large 2D optoelectronic device arrays for free-space optical interconnects", Proc. SPIE 3490, Optics in Computing '98, (22 May 1998); https://doi.org/10.1117/12.308862

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