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4 December 1998 Optical chips interconnects: economically viable
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Abstract
We propose a simple, low cost, parallel optical data bus for CMOS to CMOS optical interconnects. At the light emission side, NRC-LEDs are chosen for their high external quantum efficiency at low currents (10 - 20% at sub-mA level), their expected high yield and temperature insensitive operation. Image Fiber Bundles (IFBs) are the medium of choice for conducting the high number of parallel light channels. IFBs are a mature product of glass technology, being at the same time flexible, low cost, low risk and highly efficient. Light is received directly in CMOS, using the concept of Spatially Modulated Light detection in combination with a Sense-Amplifier receiver at a bitrate of 180 Mbit/s.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Roger A. Vounckx, Paul L. Heremans, Daniel Coppee, Reiner Windisch, Gustaaf Borghs, and Maarten Kuijk "Optical chips interconnects: economically viable", Proc. SPIE 3491, 1998 International Conference on Applications of Photonic Technology III: Closing the Gap between Theory, Development, and Applications, (4 December 1998); https://doi.org/10.1117/12.328743
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