Paper
4 September 1998 Merged 2.5-V and 3.3-V 0.25-μm CMOS technology
Isik C. Kizilyalli, Robert Y.S. Huang, D. Hwang, Brittin C. Kane, R. Ashton, S. Kuehne, X. Deng, Michael S. Twiford, E. P. Martin, D. Shuttleworth, K. Wittingham, S. Lytle, Yi Ma, Pradip K. Roy, Leonard J. Olmer, Hem Vaidya, F. Li, X. Li, Eric Persson, A. Massengale, L. Stirling, D. Chesire, K. Steiner, Rafael N. Barba, Morgan J. Thoma, William T. Cochran
Author Affiliations +
Abstract
In this paper a merged 2.5 V and 3.3 V high performance 0.25 micrometer CMOS technology is presented. Issues relevant to manufacturing, such as Leff control and the impact of plasma-assisted back-end dielectric depositions on gate oxide reliability and isolation, are discussed. This technology features a 50 angstrom gate oxide, high-energy implant scheme, n+-polysilicon gate, and 4/5 levels of metal. An improvement of 1.45X in circuit performance and 4X in packing density is achieved over our 0.35 micrometer CMOS technology. The nominal ring oscillator delay time is 38(39) ps for 3.3(2.5) V operation.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Isik C. Kizilyalli, Robert Y.S. Huang, D. Hwang, Brittin C. Kane, R. Ashton, S. Kuehne, X. Deng, Michael S. Twiford, E. P. Martin, D. Shuttleworth, K. Wittingham, S. Lytle, Yi Ma, Pradip K. Roy, Leonard J. Olmer, Hem Vaidya, F. Li, X. Li, Eric Persson, A. Massengale, L. Stirling, D. Chesire, K. Steiner, Rafael N. Barba, Morgan J. Thoma, and William T. Cochran "Merged 2.5-V and 3.3-V 0.25-μm CMOS technology", Proc. SPIE 3506, Microelectronic Device Technology II, (4 September 1998); https://doi.org/10.1117/12.323964
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KEYWORDS
Transistors

Oxides

CMOS technology

Dielectrics

Picosecond phenomena

Deposition processes

Metals

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