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3 September 1998 Flat-type metal residue-induced metal line bridge
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Abstract
As the device feature size continues to shrink, the restriction of particles size is more critical. More effective tools are needed to identify the shaped and the contents of particles, then take corrective actions. In this paper, the source and formation of the flat type metal residue that cause metal line bridge were identified by KLA scan defect inspector and optical microscope review. The duplication of this flat type metal residue also has been achieved. And the effective monitor tool is provided in the paper to prevent the particle forming.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hung-Chi Hsiao, Po-Tao Chu, Y.M. Hsu, and Chia-Hsiang Chen "Flat-type metal residue-induced metal line bridge", Proc. SPIE 3507, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing IV, (3 September 1998); https://doi.org/10.1117/12.324336
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