This paper gives an overview of the foundry technology trend in the future. The foundry model is a part of the natural trend toward the vertical disintegration of the semiconductor industry. Foundry technology is already in the lading pack, and will be on the leading edge from now on. Foundry technology will be market driven toward low voltage, low power, high performance, high density, and system on chip. Examples of leading-edge 0.25 um logic and 0.18 micrometers and beyond process features will be used to illustrate this trend.
Jack Y. C. Sun, Jack Y. C. Sun,
"Foundry technology trend", Proc. SPIE 3507, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing IV, (3 September 1998); doi: 10.1117/12.324346; https://doi.org/10.1117/12.324346