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Damascene Cu-interconnect formation in benzocyclobuten (BCB) film using a novel end-point monitoring technique
IMP Ta/Cu seed layer technology for high-aspect-ratio via fill by electroplating, and its application to multilevel single-damascene copper interconnects
Characterization of pattern density and the metal stack composition on chlorine residues from the metal etch process
Equipment challenges for a total material system change: enabling device manufacturing at 130 nm and below