4 September 1998 Applications of Forcefill aluminum for contact and via metallization
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Abstract
The application of Forcefill®, the high pressure holefill technique for 0.5 micrometer device production is discussed in this paper. For process optimization holefill characteristics are presented as function of Forcefill® pressure, temperature and process time. Holefill analysis is performed by SEM plan view and cross section. SEM results are correlated to resistance measurements. The productivity of the Forcefill® process is discussed also. Data are presented showing the very low particle additions achievable with this technique.
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Juergen Foerster, Juergen Foerster, Werner K. Robl, Werner K. Robl, Norbert Rausch, Norbert Rausch, Manfred Frank, Manfred Frank, D. Butler, D. Butler, Paul Rich, Paul Rich, J. Marktanner, J. Marktanner, } "Applications of Forcefill aluminum for contact and via metallization", Proc. SPIE 3508, Multilevel Interconnect Technology II, (4 September 1998); doi: 10.1117/12.324040; https://doi.org/10.1117/12.324040
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