27 August 1998 Equipment challenges for a total material system change: enabling device manufacturing at 130 nm and below
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Abstract
ULSI circuit performance is constantly increasing, in sped, functionality and device density. This performance increase is supported by the constant development of new processes and new equipment platforms, which support the demand for improved defect density and throughput. A key challenge for equipment infrastructure to continue to support this performance acceleration is the shortening of cycle time for equipment development and new material acceptance.
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Alain S. Harrus, John Kelly, Ronald A. Powell, "Equipment challenges for a total material system change: enabling device manufacturing at 130 nm and below", Proc. SPIE 3509, In-Line Characterization Techniques for Performance and Yield Enhancement in Microelectronic Manufacturing II, (27 August 1998); doi: 10.1117/12.324410; https://doi.org/10.1117/12.324410
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