27 August 1998 Strategy for a flexible and inexpensive defect density line monitoring for microchip manufacturing
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Abstract
This article deals with the development of a defect density monitoring strategy for semiconductor mass production. We present an empirically justified defect density monitoring method which combines two complementary approaches. One approach works with statistical means and needs a high wafer and lot sampling rate and a systematic defect analysis and classification by review. The second approach fits more to the needs of immature production line in the development phase. The first is more conform to mature mass production. Our goal is to combine tool and product/process monitoring as well as to restrict the number of inspection gates to yield relevant levels, without losing reaction time for problems on intermediate process levels. At the same time the combination allows us to change the emphasis from monitoring with engineering character at the beginning of the lifetime of a production line towards a defect density control for mass production.
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Friedbald Kiel, Olga Andrianaivo-Golz, Doron Solomon, Gerard Bekaert, "Strategy for a flexible and inexpensive defect density line monitoring for microchip manufacturing", Proc. SPIE 3509, In-Line Characterization Techniques for Performance and Yield Enhancement in Microelectronic Manufacturing II, (27 August 1998); doi: 10.1117/12.324412; https://doi.org/10.1117/12.324412
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KEYWORDS
Inspection

Semiconducting wafers

Manufacturing

Statistical analysis

Classification systems

Digital filtering

Semiconductors

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