28 August 1998 Failure modes in microelectronic packages
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Abstract
In this paper, a novel interferometric method with a wide range of sensitivities, called holography quasi projection moire method, is presented. It combines the features of the varied double projection moire method and the holographic interferometry method. This technique has been used to study the various failure modes, such as spallation, delamination, 1D buckle, 2D buckle, and crush, in microelectronic packaging film/substrate modules. The experimental phenomenon and fracture mechanism for various failure modes are presented and analyzed.
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Xun Qing Shi, Xun Qing Shi, Wei Zhou, Wei Zhou, Hock Lye John Pang, Hock Lye John Pang, Zhenfeng P. Wang, Zhenfeng P. Wang, } "Failure modes in microelectronic packages", Proc. SPIE 3510, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (28 August 1998); doi: 10.1117/12.324385; https://doi.org/10.1117/12.324385
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