28 August 1998 Failure modes in microelectronic packages
Author Affiliations +
In this paper, a novel interferometric method with a wide range of sensitivities, called holography quasi projection moire method, is presented. It combines the features of the varied double projection moire method and the holographic interferometry method. This technique has been used to study the various failure modes, such as spallation, delamination, 1D buckle, 2D buckle, and crush, in microelectronic packaging film/substrate modules. The experimental phenomenon and fracture mechanism for various failure modes are presented and analyzed.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Xun Qing Shi, Xun Qing Shi, Wei Zhou, Wei Zhou, Hock Lye John Pang, Hock Lye John Pang, Zhenfeng P. Wang, Zhenfeng P. Wang, } "Failure modes in microelectronic packages", Proc. SPIE 3510, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (28 August 1998); doi: 10.1117/12.324385; https://doi.org/10.1117/12.324385


Holographic polarization measurements
Proceedings of SPIE (September 17 1993)
Fringe Analysis And Interpretation
Proceedings of SPIE (April 03 1989)

Back to Top