28 August 1998 Industrial use of conductive adhesives for SMT assemblies
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Abstract
Conductive adhesives are gaining interest against SnPb soldering in microelectronics assemblies. The aim of this study is to evaluate the use of conductive adhesives for industrial SMT assemblies. Hence, after a short description of the most common conductive adhesives in use, this paper presents how to settle parameters of stenciling and 'pick and place' machines ordinary used for solder joints; the temperature cure schedule of conductive adhesives is defined, and validate by physical and thermal analyses. Finally, the reliability is evaluated and failure mechanisms are pointed out.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
M. G. Perichaud, Helene Fremont, M. Salagoity, C. Faure, Yves Danto, "Industrial use of conductive adhesives for SMT assemblies", Proc. SPIE 3510, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (28 August 1998); doi: 10.1117/12.324370; https://doi.org/10.1117/12.324370
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