31 August 1998 Advances in LIGA-based post mold fabrication
Author Affiliations +
Proceedings Volume 3511, Micromachining and Microfabrication Process Technology IV; (1998) https://doi.org/10.1117/12.324299
Event: Micromachining and Microfabrication, 1998, Santa Clara, CA, United States
The establishment of a process to allow planarization of deep x-ray lithography based microfabricated metal components via diamond lapping has enabled examination of three additional microfabrication issues. The areas of improvement that are discussed include materials, microassembly and packaging, and multilevel fabrication. New materials work has centered on magnetic materials including precision micromagnets and surface treatments of electrodeposited materials. Assembly and packaging has been aided by deep silicon etch processing and the use of conventional precision milling equipment combined with press-fit assembly. Diffusion bonding is shown to be a particularly important approach to achieving multilevel metal mechanisms and furthermore shows promise for achieving batch assembled and packaged high aspect-ratio metal micromechanics.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Todd R. Christenson, Todd R. Christenson, } "Advances in LIGA-based post mold fabrication", Proc. SPIE 3511, Micromachining and Microfabrication Process Technology IV, (31 August 1998); doi: 10.1117/12.324299; https://doi.org/10.1117/12.324299

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