31 August 1998 Combining the best of bulk and surface micromachining using Si (111) substrates
Author Affiliations +
Proceedings Volume 3511, Micromachining and Microfabrication Process Technology IV; (1998) https://doi.org/10.1117/12.324294
Event: Micromachining and Microfabrication, 1998, Santa Clara, CA, United States
Abstract
This process combines the best features of bulk and surface micromachining. It enables the production of stress free, thick, virtually arbitrarily shaped structures with well defined, thick or thin sacrificial layers, high sacrificial layer selectivity and large undercuts using IC compatible, processes. The basis of this approach is the use of readily available {111} oriented substrates, anisotropic Si trench etching, SiN masking and KOH etching.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
James G. Fleming, "Combining the best of bulk and surface micromachining using Si (111) substrates", Proc. SPIE 3511, Micromachining and Microfabrication Process Technology IV, (31 August 1998); doi: 10.1117/12.324294; https://doi.org/10.1117/12.324294
PROCEEDINGS
7 PAGES


SHARE
Back to Top