31 August 1998 Micromachining technologies for miniaturized communication devices
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Proceedings Volume 3511, Micromachining and Microfabrication Process Technology IV; (1998) https://doi.org/10.1117/12.324302
Event: Micromachining and Microfabrication, 1998, Santa Clara, CA, United States
An overview of the key micromachining technologies that enable communications applications for MEMS is presented with a focus on frequency-selective devices. In particular, micromechanical filters are briefly reviewed and key technologies needed to extend their frequencies into the high VHF and UHF ranges are anticipated. Series resistance in interconnect or structural materials is shown to be a common concern for virtually all RF MEMS components, from mechanical vibrating beams, to high-Q inductors and tunable capacitors, to switches and antennas. Environmental parasites -- such as feedthrough capacitance, eddy currents, and molecular contaminants -- are identified as major performance limiters for RF MEMS. Strategies for eliminating them via combinations of monolithic integration and encapsulation packaging are described.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Clark T.-C. Nguyen, "Micromachining technologies for miniaturized communication devices", Proc. SPIE 3511, Micromachining and Microfabrication Process Technology IV, (31 August 1998); doi: 10.1117/12.324302; https://doi.org/10.1117/12.324302

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