31 August 1998 Novel and high-yield fabrication of electroplated 3D microcoils for MEMS and microelectronics
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Proceedings Volume 3511, Micromachining and Microfabrication Process Technology IV; (1998) https://doi.org/10.1117/12.324306
Event: Micromachining and Microfabrication, 1998, Santa Clara, CA, United States
Abstract
A novel and high-yield process is presented to fabricate electroplated 3D micro-coils for MEMS and microelectronics. The 3D Solenoid-type Integrated Inductor (SI2) is decomposed into two parts, bottom conductor lines and air bridges. The bridges are formed by only one electroplating step. This single-step fabrication of the electroplated air bridges is possible by forming the 3D photoresist mold with a Multi-Exposure and Single Development method (MESD). We have successfully demonstrated 3D micro-coils with or without a core. This method is so easy and simple that we can dramatically improve the fabrication yield, which is the hardest obstacle in the various 3D micro-coil fabrication methods. Also, this method has good IC process compatibility owing to low process temperature and the monolithic feature.
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Jun-Bo Yoon, Jun-Bo Yoon, Chul-Hi Han, Chul-Hi Han, Euisik Yoon, Euisik Yoon, Choong-Ki Kim, Choong-Ki Kim, } "Novel and high-yield fabrication of electroplated 3D microcoils for MEMS and microelectronics", Proc. SPIE 3511, Micromachining and Microfabrication Process Technology IV, (31 August 1998); doi: 10.1117/12.324306; https://doi.org/10.1117/12.324306
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