1 September 1998 Adhesion between PMMA mask layer and silicon wafer in KOH aqueous solution
Author Affiliations +
Proceedings Volume 3512, Materials and Device Characterization in Micromachining; (1998) https://doi.org/10.1117/12.324086
Event: Micromachining and Microfabrication, 1998, Santa Clara, CA, United States
Abstract
The adhesion of PMMA layers on silicon wafer has been studied in order to protect the front side of the silicon wafer while etching the backside in KOH aqueous solution. Pre and post-bake treatment have been performed, different primers have been used to optimise the superficial and interfacial tension of both mask layer and substrate. An adherent layer has been obtained and its behaviour has been explained based on the polar and nonpolar interactions across the interface.

Keywords: PMMA, silicon, KOH, work of adhesion, surface energy, interfacial tension, superficial tension, contact angle.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Mihaela Ilie, Mihaela Ilie, Bogdan Marculescu, Bogdan Marculescu, Nicolae Moldovan, Nicolae Moldovan, Nicoleta Nastase, Nicoleta Nastase, Mihaela Olteanu, Mihaela Olteanu, } "Adhesion between PMMA mask layer and silicon wafer in KOH aqueous solution", Proc. SPIE 3512, Materials and Device Characterization in Micromachining, (1 September 1998); doi: 10.1117/12.324086; https://doi.org/10.1117/12.324086
PROCEEDINGS
9 PAGES


SHARE
RELATED CONTENT

A new ZEP520 P(MMA MAA) ZEP520 trilayer process for T...
Proceedings of SPIE (January 26 2005)
X-Ray Lithography For Integrated Circuits - A Review
Proceedings of SPIE (August 07 1977)
Passive optical devices in polymers
Proceedings of SPIE (January 19 1994)
Waveguides in polymers
Proceedings of SPIE (September 27 1994)

Back to Top