8 September 1998 Acoustic wavelet analysis using micro-electro-mechanical sensors
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Proceedings Volume 3514, Micromachined Devices and Components IV; (1998) https://doi.org/10.1117/12.323905
Event: Micromachining and Microfabrication, 1998, Santa Clara, CA, United States
We have developed several types of mechanical and electro- mechanical acoustic sensors using SOI (silicon on insulator) micromachining technique. This paper describes the design, the fabrication and the characterization of three such acoustic sensors. The goal of our research is to integrate a preprocessor for a voice/speech recognition system on a silicon chip, and to create an implantable hearing aid device.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Markus Mueller, Markus Mueller, Hiroshi Toshiyoshi, Hiroshi Toshiyoshi, Hiroyuki Fujita, Hiroyuki Fujita, "Acoustic wavelet analysis using micro-electro-mechanical sensors", Proc. SPIE 3514, Micromachined Devices and Components IV, (8 September 1998); doi: 10.1117/12.323905; https://doi.org/10.1117/12.323905

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