8 September 1998 Micro-electro-optical devices in a five-level polysilicon surface-micromachining technology
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Proceedings Volume 3514, Micromachined Devices and Components IV; (1998) https://doi.org/10.1117/12.323889
Event: Micromachining and Microfabrication, 1998, Santa Clara, CA, United States
We recently reported on the development of a 5-level polysilicon surface micromachine fabrication process consisting of four levels of mechanical poly plus an electrical interconnect layer and its application to complex mechanical systems. This paper describes the application of this technology to create micro-optical systems-on-a-chip. These are demonstration systems, which show that give levels of polysilicon provide greater performance, reliability, and significantly increased functionality. This new technology makes it possible to realize levels of system complexity that have so far only existed on paper, while simultaneously adding to the robustness of many of the individual subassemblies.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
James H. Smith, James H. Smith, M. Steven Rodgers, M. Steven Rodgers, Jeffry J. Sniegowski, Jeffry J. Sniegowski, Samuel L. Miller, Samuel L. Miller, Dale L. Hetherington, Dale L. Hetherington, Paul J. McWhorter, Paul J. McWhorter, Mial E. Warren, Mial E. Warren, } "Micro-electro-optical devices in a five-level polysilicon surface-micromachining technology", Proc. SPIE 3514, Micromachined Devices and Components IV, (8 September 1998); doi: 10.1117/12.323889; https://doi.org/10.1117/12.323889

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