8 September 1998 Self-aligned polysilicon MEMS-reduced mask count surface micromachining
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Proceedings Volume 3514, Micromachined Devices and Components IV; (1998) https://doi.org/10.1117/12.323904
Event: Micromachining and Microfabrication, 1998, Santa Clara, CA, United States
Abstract
A self-aligned reduced mask count micromachined polysilicon on nitride (SAMPSON) surface micromachining process is introduced. The self-alignment fabrication concept enables rapid fabrication, improves yields, and reduces parasitic capacitance of MEM devices. For many MEM devices the SAMPSON process results in a one mask savings over more conventional approaches. As a demonstration of the fabrication technique a burst-proof surface micromachined polysilicon resonant pressure sensor is fabricated using the SAMPSON process. This pressure sensor does not require a sealed cavity. It is also insensitive to mechanical property variations of the structural material, rendering its response essentially temperature independent.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
J. Mark Noworolski, Seth R. Sanders, "Self-aligned polysilicon MEMS-reduced mask count surface micromachining", Proc. SPIE 3514, Micromachined Devices and Components IV, (8 September 1998); doi: 10.1117/12.323904; https://doi.org/10.1117/12.323904
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