8 September 1998 Simultaneous fabrication of dielectric and electric joints by wafer bonding
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Proceedings Volume 3514, Micromachined Devices and Components IV; (1998) https://doi.org/10.1117/12.323914
Event: Micromachining and Microfabrication, 1998, Santa Clara, CA, United States
Abstract
Wafer bonding is a key technology for the fabrication of micro mechanical systems which consist of two or more stacked silicon parts. Among the different bonding methods anodic bonding with an intermediate layer of Pyrex glass offers several advantages concerning the process flexibility and the stability of the bond. To use this technology the sputter deposition process of Pyrex glass was optimized and the anodic bonding process was characterized. A process for a capacitive pressure sensor was designed which included bond frames made out of sputtered glass. The electrical contact from both electrodes to contact pads was realized by lateral and vertical feedthroughs. The latter were obtained by an Au-Au thermocompression bond which was simultaneously fabricated with the anodic bond.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Andreas Drost, Andreas Drost, Gerhard Klink, Gerhard Klink, Sabine Scherbaum, Sabine Scherbaum, Michael Feil, Michael Feil, } "Simultaneous fabrication of dielectric and electric joints by wafer bonding", Proc. SPIE 3514, Micromachined Devices and Components IV, (8 September 1998); doi: 10.1117/12.323914; https://doi.org/10.1117/12.323914
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