Advanced mask cleaning for 0.20-um technology: an integrated user-supplier approach

Rudolf Poschenrieder; Bernd Hay; Matthias Beier; Andrew C. Hourd; Harald Stuemer; Thomas M. Gairing

doi:10.1117/12.332848

18 December 1998 Advanced mask cleaning for 0.20-μm technology: an integrated user-supplier approach

Rudolf Poschenrieder, Bernd Hay, Matthias Beier, Andrew C. Hourd, Harald Stuemer, Thomas M. Gairing

Proceedings Volume 3546, 18th Annual BACUS Symposium on Photomask Technology and Management; (1998) https://doi.org/10.1117/12.332848
Event: 18th Annual BACUS Symposium on Photomask Technology and Management, 1998, Redwood City, CA, United States

Abstract

A newly developed photomask final cleaning system, STEAG HamaTech's Advanced Single Substrate Cleaner, ASC 500, was assessed and optimized at the Siemens mask shop in Munich, Germany, under production conditions within the Esprit European Semiconductor Equipment Assessment programme (SEA). The project was carried out together with the active participation of Compugraphics Intl. Ltd. (UK), DuPont Photomasks, Inc. (Germany) and Photronics-MZD (Germany). The results of the assessment are presented, focusing on the cleaning performance at the 0.25 micrometer defect level on photomasks, equipment reliability and Cost of Ownership data. A reticle free of soft defects on glass and on chrome down to the 0.25 micrometer level requires an excellent cleaning process and the use of high-end inspection tools like the KLA STARlight. In order to get a full understanding of the nature of the detected features additional investigations on the blank quality have been carried out. These investigations include the questions whether a detection is a hard or a soft defect and whether small defects on chrome are able to move on the reticle surface. Final cleaning recipes have been optimized in respect to cleaning efficiency while maintaining high throughput and low Cost of Ownership. A benchmark comparison against other final cleaning tools at the partner's maskshops showed the leading data of the ASC 500. It was found that a cleaning program which includes several substrate flips and a combination of the available cleaning methods acid- dispense, water pressure jet clean, brush and megasonic clean was best suitable to achieve these goals. In particular the use of the brush unit was shown to improve the yield while not adding damage to the plate.

Citation Download Citation

Rudolf Poschenrieder, Bernd Hay, Matthias Beier, Andrew C. Hourd, Harald Stuemer, and Thomas M. Gairing "Advanced mask cleaning for 0.20-μm technology: an integrated user-supplier approach", Proc. SPIE 3546, 18th Annual BACUS Symposium on Photomask Technology and Management, (18 December 1998); https://doi.org/10.1117/12.332848

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KEYWORDS

Photomasks

Inspection

Stereolithography

Glasses

Quartz

Reliability

Defect detection

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