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18 December 1998 Defect inspection capability for advanced OPC photomasks
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Advanced optical proximity correction (OPC) designs have resulted in many challenges for both the manufacturers of photomasks and automated defect inspection equipment. The successful manufacture of advanced OPC photomasks includes the ability to resolve the OPC features, complete an automated defect inspection that captures all of the defects of concern, and accurately recognize and disposition these defects. New defect types associated with OPC features are important and will print on a wafer or affect critical feature dimensions. Advances in defect detection on designs with OPC required breakthroughs by both the photomask and inspection system manufacturer. Process improvements focused on better resolving OPC features, along with advancements in automated defect inspection systems, have resulted in overall improvements in automated defect infection capability for OPC designs. The ability of OPC inspection algorithms to detect critical defects was confirmed with the DuPont VerithoroTM 890, the OPC3 programed defect test reticle, and defect capture occurrences on actual designs with advanced OPC features. Sensitivity improvements of up to 0.17 micrometer were demonstrated for both OPC and non-OPC type defects.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Joseph A. Straub, Anthony Vacca, and Larry S. Zurbrick "Defect inspection capability for advanced OPC photomasks", Proc. SPIE 3546, 18th Annual BACUS Symposium on Photomask Technology and Management, (18 December 1998);

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