15 July 1999 Excimer laser cleaning for microelectronics: modeling, applications, and challenges
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Abstract
Chlorofluorocarbon-free laser cleaning techniques, compatible with cluster tool processing, have been developed for application to microelectronics processing, A KrF excimer laser is directed toward the wafer to be cleaned and rastered over the surface which might be intentionally covered by a thin liquid layer. It is demonstrated that various types of submicrometer-sized particles including polystyrene latex, silica and alumina, can be efficiently removed, by laser cleaning, from the front sides of silicon wafers. These results are explained by a particle adhesion model, including van der Waals forces and hydrogen bonding, and a particle removal model involving rapid thermal expansion of the substrate due to the thermoelastic effect and the pressure shock due to bubble generation in the condensed water film. The result of the calculations of the adhesions and removal models are consistent with the experimental observations. In addition, the excimer laser technique was successfully used to remove micrometer-sized metallic particles from the backsides of silicon wafers; such a removal represents a challenging task in today's integrated circuit technology.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Michel Meunier, Michel Meunier, Xiaoguang Wu, Xiaoguang Wu, Felix Beaudoin, Felix Beaudoin, Edward Sacher, Edward Sacher, Martine Simard-Normandin, Martine Simard-Normandin, } "Excimer laser cleaning for microelectronics: modeling, applications, and challenges", Proc. SPIE 3618, Laser Applications in Microelectronic and Optoelectronic Manufacturing IV, (15 July 1999); doi: 10.1117/12.352691; https://doi.org/10.1117/12.352691
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