14 April 1999 Ceramic-metal composites as a solution for high-performance semiconductor laser packaging
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Packaging is one of the most critical operation in optoelectronics manufacturing. Optoelectronic packages for semiconductor laser diodes must provide submicron alignment between optical elements, high-speed electrical connections, excellent heat dissipation, and high reliability. We propose the use of composite substrate materials that simplify the design of optoelectronic packages, improve thermal and mechanical performance, and are suitable for high- reliability applications.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jean-Marc Verdiell, Jean-Marc Verdiell, } "Ceramic-metal composites as a solution for high-performance semiconductor laser packaging", Proc. SPIE 3626, Testing, Packaging, Reliability, and Applications of Semiconductor Lasers IV, (14 April 1999); doi: 10.1117/12.345428; https://doi.org/10.1117/12.345428


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