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14 April 1999 Densely packed surface-emitting laser arrays for printing applications
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Abstract
We report on our efforts to develop a laser printbar consisting of a very dense array of independently addressable laterally-oxidized top-emitting VCSELs. In order to maintain wafer planarity for easy electrical routing, the buried oxidation layer in our structure is accessed through small via holes instead of a more typical mesa etch. Unlike most VCSELs, our devices utilize transparent indium-tin- oxide top contacts that allow for a more compact device design. The 200-element array we fabricated has a linear density of one device every 3 micrometers .
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Christopher L. Chua, Robert L. Thornton, David W. Treat, and Rose M. Donaldson "Densely packed surface-emitting laser arrays for printing applications", Proc. SPIE 3626, Testing, Packaging, Reliability, and Applications of Semiconductor Lasers IV, (14 April 1999); https://doi.org/10.1117/12.345418
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