Translator Disclaimer
14 April 1999 Hermetic diode laser transmitter module
Author Affiliations +
In very demanding optoelectronic sensor applications it is necessary to encapsulate semiconductor components hermetically in metal housings to ensure reliable operation of the sensor. In this paper we report on the development work to package a laser diode transmitter module for a time- off-light distance sensor application. The module consists of a lens, laser diode, electronic circuit and optomechanics. Specifications include high acceleration, -40....+75 degree(s)C temperature range, very low gas leakage and mass-production capability. We have applied solder glasses for sealing optical lenses and electrical leads hermetically into a metal case. The lens-metal case sealing has been made by using a special soldering glass preform preserving the optical quality of the lens. The metal housings are finally sealed in an inert atmosphere by welding. The assembly concept to retain excellent optical power and tight optical axis alignment specifications is described. The reliability of the laser modules manufactured has been extensively tested using different aging and environmental test procedures. Sealed packages achieve MIL- 883 standard requirements for gas leakage.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jyrki Ollila, Kari Kautio, Jouko Vahakangas, Tapio Hannula, Harri K. Kopola, Jorma Oikarinen, and Matti Sivonen "Hermetic diode laser transmitter module", Proc. SPIE 3626, Testing, Packaging, Reliability, and Applications of Semiconductor Lasers IV, (14 April 1999);


Glass Sealing Of Optical Fibers
Proceedings of SPIE (December 21 1989)
Flip chip VCSEL arrays on transparent substrates
Proceedings of SPIE (March 14 2005)
Glass Sealing Of Optical Fibers
Proceedings of SPIE (January 05 1990)

Back to Top