30 April 1999 Electrical crosstalk analysis in OEIC modules
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A complete set of methods for the calculation of electrical crosstalk in Optoelectronic Integrated Circuits is presented. From the examination of typical chip architecture, it is shown that the inductive coupling due to thin bondwires is critical. The model can be easily applied to several OEICs. Design guidelines are presented.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Dimitrios Varoutas, Dimitrios Varoutas, A. Arapogianni, A. Arapogianni, Dimitrios Syvridis, Dimitrios Syvridis, Thomas Sphicopoulos, Thomas Sphicopoulos, } "Electrical crosstalk analysis in OEIC modules", Proc. SPIE 3631, Optoelectronic Integrated Circuits and Packaging III, (30 April 1999); doi: 10.1117/12.348323; https://doi.org/10.1117/12.348323

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