Main characteristics of a miniaturized multipurpose infrared spectrometer

Kimmo Keraenen; Martti Blomberg; Outi Rusanen; Pentti Karioja; Jussi Tenhunen; Harri K. Kopola; Ari Lehto

doi:10.1117/12.348309

30 April 1999 Main characteristics of a miniaturized multipurpose infrared spectrometer

Kimmo Keraenen, Martti Blomberg, Outi Rusanen, Pentti Karioja, Jussi Tenhunen, Harri K. Kopola, Ari Lehto

Proceedings Volume 3631, Optoelectronic Integrated Circuits and Packaging III; (1999) https://doi.org/10.1117/12.348309
Event: Optoelectronics '99 - Integrated Optoelectronic Devices, 1999, San Jose, CA, United States

Abstract

This paper describes the main characteristics of a miniaturized multipurpose IR spectrometer. The miniaturized spectrometer comprise of three silicon micromachined devices: an electrically modulated thermal IR emitter, and electrically tunable Fabry-Perot interferometer and a photodetector. The IR emitter and the detector are monolithically integrated into a silicon substrate. In addition, the silicon substrate carries an integrated circuit die-bonded and wire-bonded on the silicon substrate. The whole spectrometer assembly is packaged in a DIL package having holes for the incoming and outgoing radiation. The dimensions of the package are 12 mm X 23 mm X 5 mm. This concept enables the realization of a miniaturized spectrometer for high-volume and low-cost products. In the miniaturization, the critical optical characteristic is the throughput of a system. In addition, the S/N-ratio and crosstalk of the module are the main electrical characteristics to be considered in the miniaturization. In this paper, the performance of the spectrometer module is presented via measurements including the radiometric analysis, S/N-ratio analysis and crosstalk analysis.

Citation Download Citation

Kimmo Keraenen, Martti Blomberg, Outi Rusanen, Pentti Karioja, Jussi Tenhunen, Harri K. Kopola, and Ari Lehto "Main characteristics of a miniaturized multipurpose infrared spectrometer", Proc. SPIE 3631, Optoelectronic Integrated Circuits and Packaging III, (30 April 1999); https://doi.org/10.1117/12.348309

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