Micro integration of VCSELs, detectors, and optics

John Barnett Hammond; Eric G. Johnson; Hongtao Han; Adam S. Fedor

doi:10.1117/12.348316

30 April 1999 Micro integration of VCSELs, detectors, and optics

John Barnett Hammond, Eric G. Johnson, Hongtao Han, Adam S. Fedor

Proceedings Volume 3631, Optoelectronic Integrated Circuits and Packaging III; (1999) https://doi.org/10.1117/12.348316
Event: Optoelectronics '99 - Integrated Optoelectronic Devices, 1999, San Jose, CA, United States

Abstract

System alignment is often the cost driver in the production of optical system. In order to both miniaturize and reduce production costs, wafer scale integration of active and passive components is required. This integration relies on a host of techniques to align and bond active and passive devices into a monolithic structure. Moreover, this initial packaging is accomplished while the optics and supporting structures are in wafer form, thereby providing parallel fabrication with resultant cost savings. This paper describes the fundamental techniques for producing IMOS from wafer scale substrates. The relative merits of each approach are discussed, along with design concerns for successful application. Two example systems are discussed, each using a different fabrication technique.

Citation Download Citation

John Barnett Hammond, Eric G. Johnson, Hongtao Han, and Adam S. Fedor "Micro integration of VCSELs, detectors, and optics", Proc. SPIE 3631, Optoelectronic Integrated Circuits and Packaging III, (30 April 1999); https://doi.org/10.1117/12.348316

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