30 April 1999 Optical interconnects for high-speed data links
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We demonstrate the integration of vertical-cavity surface- emitting laser (VCSEL) arrays with Si-dummy chips for potential use in short-distance parallel optical interconnects. An 8 X 8 flip-chip bonded InGaAs VCSEL array was successfully modulated at data rates up to 0.8 Gbit/s/channel, corresponding to an aggregate data transmission capacity in excess of 50 Gbit/s. A 2 X 4 VCSEL array was indirectly flit-chip bonded to a Si substrate via a transparent glass carrier and package- limited data rates of 0.4 Gbit/s/channel were achieved. The large signal modulation bandwidth of these devices exceeded 2 Gbit/s. The electrical driving characteristics of the devices were found to be compatible with 3.3 V CMOS technology.
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Chang Myung Ryu, Chang Myung Ryu, Bernhard Ulrich Koelle, Bernhard Ulrich Koelle, Shane R. Johnson, Shane R. Johnson, Philip Dowd, Philip Dowd, Raenaurd Datrion Turpin, Raenaurd Datrion Turpin, Parag Kelkar, Parag Kelkar, YongHang Zhang, YongHang Zhang, } "Optical interconnects for high-speed data links", Proc. SPIE 3631, Optoelectronic Integrated Circuits and Packaging III, (30 April 1999); doi: 10.1117/12.348313; https://doi.org/10.1117/12.348313

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