Overview of NECI projects on thin-cladding POF-based optical interconnects

Yao Li

doi:10.1117/12.344631

13 April 1999 Overview of NECI projects on thin-cladding POF-based optical interconnects

Yao Li

Proceedings Volume 3632, Optoelectronic Interconnects VI; (1999) https://doi.org/10.1117/12.344631
Event: Optoelectronics '99 - Integrated Optoelectronic Devices, 1999, San Jose, CA, United States

Abstract

We review recent progresses in various POF related optical interconnect projects at NEC Research Institute. These projects were initiated to study cost-effective sub-local optical interconnect solutions that can potentially compete with copper-based solutions in future. The projects include both coupling schemes for networking various POF data links, and point-to-point polymer circuits which can route data in both serial and parallel formats. Many of the mentioned projects are still on-going and thus the report here has the nature of progress update.

Citation Download Citation

Yao Li "Overview of NECI projects on thin-cladding POF-based optical interconnects", Proc. SPIE 3632, Optoelectronic Interconnects VI, (13 April 1999); https://doi.org/10.1117/12.344631

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