13 April 1999 Overview of NECI projects on thin-cladding POF-based optical interconnects
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Abstract
We review recent progresses in various POF related optical interconnect projects at NEC Research Institute. These projects were initiated to study cost-effective sub-local optical interconnect solutions that can potentially compete with copper-based solutions in future. The projects include both coupling schemes for networking various POF data links, and point-to-point polymer circuits which can route data in both serial and parallel formats. Many of the mentioned projects are still on-going and thus the report here has the nature of progress update.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yao Li, Yao Li, } "Overview of NECI projects on thin-cladding POF-based optical interconnects", Proc. SPIE 3632, Optoelectronic Interconnects VI, (13 April 1999); doi: 10.1117/12.344631; https://doi.org/10.1117/12.344631
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