22 March 1999 CSP optoelectronic package for imaging and light detection applications
Author Affiliations +
Abstract
Portability and miniaturization are key factors in the electronic product market. A fast growing market is Digital Photographs. with a variety of small size and low weight electronic products. for protessional and personal photography, medical and video con terencing lhe development of lo cost imaging devices drives the market for low cost Packages br ()pto-Electronic imaging dice. A recent packaging technology development (1.2) oIlers a substantial reduction of both costs and physical dimension of the Opto-electronic package.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Itzik Shweky, Itzik Shweky, Avner P. Badihi, Avner P. Badihi, "CSP optoelectronic package for imaging and light detection applications", Proc. SPIE 3650, Sensors, Cameras, and Applications for Digital Photography, (22 March 1999); doi: 10.1117/12.342864; https://doi.org/10.1117/12.342864
PROCEEDINGS
6 PAGES


SHARE
RELATED CONTENT

Status of the MEMS industry
Proceedings of SPIE (January 21 2005)
European MEMS foundries
Proceedings of SPIE (January 14 2003)
Imaging CSP a die size optical package for CMOS...
Proceedings of SPIE (May 14 2000)

Back to Top