8 March 1999 Submicron defect detection by SEMSpec: an e-beam wafer inspection system
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Abstract
Traditionally, automated optical inspection techniques have been sufficient to find defects on wafers. However, defects smaller than 0.25 (mu) simply cannot be resolved by light optics due to optical limitation. KLA-Tencor SEMSpec is an advanced scanning electron-beam wafer inspection system that can detect defects down to 0.1 (mu) . The electron beam is scanned over the specimen surface, causing secondary electrons to be emitted from the surface where the beam impinges. These emitted secondary electrons are detected and the resulting image is formed so that conventional image processing techniques can also be applied. In the inspection sequence, fundamental parameters such as pixel size, defect detection sensitivity threshold, signal averaging, and cluster distance can be adjusted.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ning S. Chang, Ning S. Chang, } "Submicron defect detection by SEMSpec: an e-beam wafer inspection system", Proc. SPIE 3652, Machine Vision Applications in Industrial Inspection VII, (8 March 1999); doi: 10.1117/12.341147; https://doi.org/10.1117/12.341147
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