23 April 1999 Pattern placement metrology tool matching within DPI's sites
Author Affiliations +
Proceedings Volume 3665, 15th European Conference on Mask Technology for Integrated Circuits and Microcomponents '98; (1999); doi: 10.1117/12.346209
Event: 15th European Conference on Mask Technology for Integrated Circuits and Micro-Components, 1998, Munich, Germany
Abstract
The requirements of the 0.18 micrometers and 0.25 micrometers technologies lead to advanced specifications for the mask making technology in terms of pattern placement metrology, tighter than 52nm for the 0.25 micrometers generation and around 35nm for the next 0.18 micrometers generation. In addition, the tremendous demand regarding cycle time reduction, performance to delivery schedule, and technical complexity on products impose to the mask manufacturer like Dupont Photomasks Inc. (DPI) the necessity to mix and match products between all the DPI sites. From this perspective, the matching of all the pattern placement metrology tools of all DPI production sites is mandatory. In order to control the tight specifications, the strategy for metrology is to implement a unique grid for registration on a world wide base at DPI and to calibrate all metrology tools and all writing tools to this standard grid. All investigations were performed on the LEICA LMS IPRO tools using the new correction software form Leica Microsystems.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Norbert Talene, Klaus-Dieter Roeth, "Pattern placement metrology tool matching within DPI's sites", Proc. SPIE 3665, 15th European Conference on Mask Technology for Integrated Circuits and Microcomponents '98, (23 April 1999); doi: 10.1117/12.346209; https://doi.org/10.1117/12.346209
PROCEEDINGS
4 PAGES


SHARE
KEYWORDS
Metrology

Photomasks

Calibration

Manufacturing

Lithography

Mask making

Overlay metrology

RELATED CONTENT


Back to Top