Opportunities and challenges for MEMS technology in Army missile systems applications

Paul B. Ruffin

doi:10.1117/12.354266

20 July 1999 Opportunities and challenges for MEMS technology in Army missile systems applications

Paul B. Ruffin

Proceedings Volume 3673, Smart Structures and Materials 1999: Smart Electronics and MEMS; (1999) https://doi.org/10.1117/12.354266
Event: 1999 Symposium on Smart Structures and Materials, 1999, Newport Beach, CA, United States

Abstract

The military market drives the thrust for the development of robust, high performance MicroElectroMechanical Systems (MEMS) devices with applications such as: competent and smart munitions, aircraft and missile autopilots, tactical missile guidance, fire control systems, platform stabilization, smart structures with embedded inertial sensors, missile system health monitoring, aerodynamic flow control, and multiple intelligent small projectiles. Army missile applications will be a fertile market for MEMS products, such as MEMS-based inertial sensors. MEMS technology should significantly enhance performance and provide more robust mission capability in applications where arrays of MEMS devices are required. The Army Aviation and Missile Command Missile Research, Development, and Engineering Center is working diligently with other government agencies, academia, and industry to develop high performing MEMS devices to withstand shock, vibration, temperature, humidity, and long-term storage conditions often encountered by Army missile systems. The goals of the ongoing DARPA MEMS technology programs will meet a significant portion of the Army missile systems requirements. In lieu of presenting an all-inclusive review of Army MEMS applications, this paper addresses a number of opportunities and associated challenges for MEMS systems operating in military environments. Near term applications and the less mature, high-risk applications of MEMS devices are addressed.

Citation Download Citation

Paul B. Ruffin "Opportunities and challenges for MEMS technology in Army missile systems applications", Proc. SPIE 3673, Smart Structures and Materials 1999: Smart Electronics and MEMS, (20 July 1999); https://doi.org/10.1117/12.354266

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