25 June 1999 Finite element modeling of ion-beam lithography masks for pattern transfer distortions
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As one of the Next Generation Lithographies, Ion-beam Projection Lithography (IPL) will be subject to strict error budgets for the sub-130 nm regime and will require high patter placement accuracy. Meeting these stringent conditions in a timely and cost-effective manner will depend upon accurate predictions of the mechanical distortions induced in IPL stencil masks during fabrication and pattern transfer. To simulate pattern transfer, finite element (FE) structural models of the stencil masks have been developed to predict distortions due to the fabrication of voids in stressed mask membranes. In this paper, an application of FE modeling for stencil masks has been demonstrated using both the IBM Falcon pattern and more uniform patterns.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Gary A. Frisque, Gary A. Frisque, Richard O. Tejeda, Richard O. Tejeda, Edward G. Lovell, Edward G. Lovell, Roxann L. Engelstad, Roxann L. Engelstad, } "Finite element modeling of ion-beam lithography masks for pattern transfer distortions", Proc. SPIE 3676, Emerging Lithographic Technologies III, (25 June 1999); doi: 10.1117/12.351145; https://doi.org/10.1117/12.351145


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