Automatic macroinspection system

Koichiro Komatsu; Takeo Omori; Toshiaki Kitamura; Yasuharu Nakajima; Arun A. Aiyer; Kyoichi Suwa

doi:10.1117/12.350863

14 June 1999 Automatic macroinspection system

Koichiro Komatsu, Takeo Omori, Toshiaki Kitamura, Yasuharu Nakajima, Arun A. Aiyer, Kyoichi Suwa

Proceedings Volume 3677, Metrology, Inspection, and Process Control for Microlithography XIII; (1999) https://doi.org/10.1117/12.350863
Event: Microlithography '99, 1999, Santa Clara, CA, United States

Abstract

Macroscopic defects on a wafer are caused by contamination, inhomogeneous resist-thickness, scratches etc. Many of these effects can be observed directly by human eyes rather than through a microscope. In many lithographic processes visual inspection by human operator is performed on all wafers after the developing process. It is called a 'macro inspection'. However a macro inspection takes skill of detecting defects, because defects can be found under some conditions. We have been developing a new inspection system to replace operator-inspection with instrument-inspection for consistency in results. This system is constructed by a defect detecting technology and an image processing technology.

Citation Download Citation

Koichiro Komatsu, Takeo Omori, Toshiaki Kitamura, Yasuharu Nakajima, Arun A. Aiyer, and Kyoichi Suwa "Automatic macroinspection system", Proc. SPIE 3677, Metrology, Inspection, and Process Control for Microlithography XIII, (14 June 1999); https://doi.org/10.1117/12.350863

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