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11 June 1999 Characterization and lithographic parameter extraction for the modified resists
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Abstract
The modification of the i-line resist structure after spiking with various amount of poly(4-vinylphenol) polymer is characterized by the spectra of UV visible and gel permeation chromatography. The chemical structure of photoactive compound is found to be unchanged after modification, while slight change in the polymer chain is observed. The resist layer coated onto the wafer is characterized by various methods including n and k analyzer, Nanospec, Fourier transform IR red, thermogravimetric analysis, and differential scanning calorimetry to fully evaluate the film properties in terms of porosity, thickness, vibrational spectrum, and thermal stability. Our thermal analysis results show that the resists are mainly decomposed in three stages. The photoactive compound is found to decompose during the first stage, while the polymer decomposes during the latter stages. The resist exposure parameters, namely, A, B and C at 365 nm are determined by the absorbance measurement. The extracted parameters are further used in the resist profile simulation by PROLITH/2. It is shown that the spiking of poly(4-vinylphenol) polymer into the resist can improve the resolution and linearity for dense lines. In addition, the swing effects can be reduced by up to 35 and 31 percent for dense and isolated lines after resist modification, respectively.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Fu-Hsiang Ko, June-Kuen Lu, Tien-Chi Chu, Tiao-Yuan Huang, ChinCheng Yang, Jinn-Tsair Sheu, and Hui-Ling Huang "Characterization and lithographic parameter extraction for the modified resists", Proc. SPIE 3678, Advances in Resist Technology and Processing XVI, (11 June 1999); https://doi.org/10.1117/12.350225
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