11 June 1999 Low-temperature technique for thick film resist stabilization and curing
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For a range of thick film photoresist applications, including MeV ion implant processing, thin film head manufacturing, and microelectromechanical systems processing, there is a need for a low-temperature method for resist stabilization and curing. Traditional methods of stabilizing or curing resist films have relied on thermal cycling, which may not be desirable due to device temperature limitations or thermally-induced distortion of the resist features.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jason P. Minter, Jason P. Minter, Selmer S. Wong, Selmer S. Wong, Trey Marlowe, Trey Marlowe, Matthew F. Ross, Matthew F. Ross, Mark E. Narcy, Mark E. Narcy, William R. Livesay, William R. Livesay, "Low-temperature technique for thick film resist stabilization and curing", Proc. SPIE 3678, Advances in Resist Technology and Processing XVI, (11 June 1999); doi: 10.1117/12.350163; https://doi.org/10.1117/12.350163

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