11 June 1999 Process characterization of 100-μm-thick photoresist films
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Proceedings Volume 3678, Advances in Resist Technology and Processing XVI; (1999); doi: 10.1117/12.350230
Event: Microlithography '99, 1999, Santa Clara, CA, United States
Abstract
The number of lithographic applications that require the use of photoresist thickness of one hundred microns or more is rapidly increasing. Extremely large structure heights and high aspect ratios are often required for micro- electrodeposition of mechanical components such as coils, cantilevers and valves. These ultra-thick photoresist can also be used as a mold in micro-electromechanical systems. Ultra-thick photoresist are also used in bump bond applications to define the size and location of the bonds for advanced flipchip packaging.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Warren W. Flack, Sylvia White, Bradley Todd, "Process characterization of 100-μm-thick photoresist films", Proc. SPIE 3678, Advances in Resist Technology and Processing XVI, (11 June 1999); doi: 10.1117/12.350230; https://doi.org/10.1117/12.350230
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KEYWORDS
Photoresist materials

Scanning electron microscopy

Semiconducting wafers

Lithography

Microelectromechanical systems

Manufacturing

Photomasks

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