Top antireflective coating process for deep-UV lithography

Allen C. Fung; Binder K. Mann; Ronald J. Eakin; Pierre Silvestre; Brad Williams; Jason Miyake; Yusuke Takano

doi:10.1117/12.350147

11 June 1999 Top antireflective coating process for deep-UV lithography

Allen C. Fung, Binder K. Mann, Ronald J. Eakin, Pierre Silvestre, Brad Williams, Jason Miyake, Yusuke Takano

Proceedings Volume 3678, Advances in Resist Technology and Processing XVI; (1999) https://doi.org/10.1117/12.350147
Event: Microlithography '99, 1999, Santa Clara, CA, United States

Abstract

This paper will evaluate the potential improvements with the addition of an aqueous based top antireflective coating to a Deep-UV process. This antireflective coating (ARC) is resistant to intermixing with the resists and is removed during the normal develop operation. A logic IC with 0.15- 0.18 micrometers design rules will be the primary test vehicle, concentrating on Contact/VIA levels. Performance will be compare with and without the top ARC. Uniformity of measured critical dimensions (CD) will be compared. CD/dose swing curve suppression, as a function of substrate and resist thickness, will be documented. The Deep-UV resist/top ARC application will be optimized, as well, to maximize throughput.

Citation Download Citation

Allen C. Fung, Binder K. Mann, Ronald J. Eakin, Pierre Silvestre, Brad Williams, Jason Miyake, and Yusuke Takano "Top antireflective coating process for deep-UV lithography", Proc. SPIE 3678, Advances in Resist Technology and Processing XVI, (11 June 1999); https://doi.org/10.1117/12.350147

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