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10 March 1999 Backside contacts for sensor structure packaging
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Proceedings Volume 3680, Design, Test, and Microfabrication of MEMS and MOEMS; (1999) https://doi.org/10.1117/12.341280
Event: Design, Test, and Microfabrication of MEMS/MOEMS, 1999, Paris, France
Abstract
The construction of both the backside contacts and the package for replaceable sensor structure bonding has been described in the paper. Some aspects of technological process for backside contact performance are discussed in the report too. The measurement results from the structure test proved small and stable contact resistance when sensor structures have been changed in the package more than 100 times. A new method of changeable package has been shown.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Barbara Janyszek, Ryszard Jachowicz, Dorota Pijanowska, and Jerzy Jazwinski "Backside contacts for sensor structure packaging", Proc. SPIE 3680, Design, Test, and Microfabrication of MEMS and MOEMS, (10 March 1999); https://doi.org/10.1117/12.341280
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