DEM technique: a new three-dimensional microfabrication technique for nonsilicon materials

Di Chen; Dacheng Zhang; Guifu Ding; Xiaolin Zhao; Jilin Zhang; Cunsheng Yang; Bingchu Cai

doi:10.1117/12.341181

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10 March 1999 DEM technique: a new three-dimensional microfabrication technique for nonsilicon materials

Di Chen, Dacheng Zhang, Guifu Ding, Xiaolin Zhao, Jilin Zhang, Cunsheng Yang, Bingchu Cai

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Proceedings Volume 3680, Design, Test, and Microfabrication of MEMS and MOEMS; (1999) https://doi.org/10.1117/12.341181
Event: Design, Test, and Microfabrication of MEMS/MOEMS, 1999, Paris, France

Abstract

DEM technique developed by present authors is a new 3D micro fabrication technique for non-silicon materials such as metals, plastics and ceramics. In comparison with LIGA technique, it does not need expensive synchrotron radiation source and x-ray masks. DEM technique has both advantages of bulk silicon micro fabrication technique and LIGA technique. In the present research, we obtained metallic mold insert with structure depth of 180 micrometers and aspect ratio more than 20. A successful development of DEm technique opens a new way for 3D micro fabrication of non-silicon materials.

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Di Chen, Dacheng Zhang, Guifu Ding, Xiaolin Zhao, Jilin Zhang, Cunsheng Yang, and Bingchu Cai "DEM technique: a new three-dimensional microfabrication technique for nonsilicon materials", Proc. SPIE 3680, Design, Test, and Microfabrication of MEMS and MOEMS, (10 March 1999); https://doi.org/10.1117/12.341181

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