Translator Disclaimer
Paper
10 March 1999 DEM technique: a new three-dimensional microfabrication technique for nonsilicon materials
Author Affiliations +
Proceedings Volume 3680, Design, Test, and Microfabrication of MEMS and MOEMS; (1999) https://doi.org/10.1117/12.341181
Event: Design, Test, and Microfabrication of MEMS/MOEMS, 1999, Paris, France
Abstract
DEM technique developed by present authors is a new 3D micro fabrication technique for non-silicon materials such as metals, plastics and ceramics. In comparison with LIGA technique, it does not need expensive synchrotron radiation source and x-ray masks. DEM technique has both advantages of bulk silicon micro fabrication technique and LIGA technique. In the present research, we obtained metallic mold insert with structure depth of 180 micrometers and aspect ratio more than 20. A successful development of DEm technique opens a new way for 3D micro fabrication of non-silicon materials.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Di Chen, Dacheng Zhang, Guifu Ding, Xiaolin Zhao, Jilin Zhang, Cunsheng Yang, and Bingchu Cai "DEM technique: a new three-dimensional microfabrication technique for nonsilicon materials", Proc. SPIE 3680, Design, Test, and Microfabrication of MEMS and MOEMS, (10 March 1999); https://doi.org/10.1117/12.341181
PROCEEDINGS
6 PAGES


SHARE
Advertisement
Advertisement
RELATED CONTENT


Back to Top