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10 March 1999 Extraction of compact models for MEMS/MOEMS package-device codesign
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Proceedings Volume 3680, Design, Test, and Microfabrication of MEMS and MOEMS; (1999) https://doi.org/10.1117/12.341265
Event: Design, Test, and Microfabrication of MEMS/MOEMS, 1999, Paris, France
Abstract
MEMS package requirements are by their nature application specific. MEMS devices are often inherently sensitive to stress induced by their packages sand often need direct access to the environment. Therefore, understanding the influence of packaging on MEMS is critical to a successful coupled package-device co-design. Here, an automated package-device interaction simulator has been developed. The simulator uses Finite Element Method models for both the package and the device analysis and ties the result of the simulations together through parametric models. This so- called Compact Model Extraction is an efficient way to solve complex problems. Several examples illustrate the use of this technique.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Vladimir L. Rabinovich, Joost C.C. Van Kuijk, Susan Zhang, Stephen F. Bart, and John R. Gilbert "Extraction of compact models for MEMS/MOEMS package-device codesign", Proc. SPIE 3680, Design, Test, and Microfabrication of MEMS and MOEMS, (10 March 1999); https://doi.org/10.1117/12.341265
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