10 March 1999 Flip-chip integration of lenslet arrays on segmented deformable micromirrors
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Proceedings Volume 3680, Design, Test, and Microfabrication of MEMS and MOEMS; (1999) https://doi.org/10.1117/12.341259
Event: Design, Test, and Microfabrication of MEMS/MOEMS, 1999, Paris, France
Flip chip assembly technology offers a reliable and advanced packaging approach for hybrid integration of micromachined optical components. In this paper we present flip chip integration of microlens arrays with surface micromachined segmented deformable micromirrors. 12 by 12 electrostatic micromirror arrays were fabricated through a commercial surface micromachining process and integrated with glass microlenses. A commercial glass microlens array is positioned directly over the micromirror. The use of a lenslet to focus the incoming laser beam onto the reflective surface of a micromirror substantially increases optical efficiency of the hybrid microsystem. For mirror deflections much smaller than the lenslet focal length, the lenslet/micromirror combination behaves as a phase-only modulating optical element. The hybrid lenslet/MEMS arrays thus serve as rugged, compact optical elements for beam steering, beam shaping, and aberration correction applications.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Adisorn Tuantranont, Adisorn Tuantranont, Victor M. Bright, Victor M. Bright, Wenge Zhang, Wenge Zhang, Y. C. Lee, Y. C. Lee, } "Flip-chip integration of lenslet arrays on segmented deformable micromirrors", Proc. SPIE 3680, Design, Test, and Microfabrication of MEMS and MOEMS, (10 March 1999); doi: 10.1117/12.341259; https://doi.org/10.1117/12.341259

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